Mobile Main Board
Description
Origin
China
Model Number
0006
Base Material
fr4
Board Thickness
1.0mm
Copper Thickness
35um
Min. Hole Size
0.1
Min. Line Spacing
3mil
Min. Line Width
3mil
Surface Finishing
immersion gold
If
you want to search quality and high-tech mother board, please feel free
to contact us! Our company always makes efforts to offering the latest
mobile phone mother board designs in order to meet customers’
requirements in time.
- Publish Date: 25-08-2015 14:51:47
- Contact name: Shenzhen Hw PCB Technology .,Ltd
- Location: China
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