Mobile Main Board

Description

Origin
China
Model Number
0006
Base Material
fr4
Board Thickness
1.0mm
Copper Thickness
35um
Min. Hole Size
0.1
Min. Line Spacing
3mil
Min. Line Width
3mil
Surface Finishing
immersion gold

If
you want to search quality and high-tech mother board, please feel free
to contact us! Our company always makes efforts to offering the latest
mobile phone mother board designs in order to meet customers’
requirements in time.

Contact Shenzhen Hw PCB Technology .,Ltd: Mobile Main Board

Phone: 86-0-134241

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